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AIC1993
Linear Fan Control Driver IC
FEATURES
VOUT Follows 1.6 Times of VSET 150mV Dropout at 500mA Output Current Over Current and Over Temperature Protection Enable Function 5uA Quiescent Current in Shutdown Mode SOP-8 Package
GENERAL DESCRIPTION
The AIC1993 is a high performance positive linear voltage regulator designed for applications requiring low dropout voltage at maximum 500mA output current. The AIC1993 VO output voltage follows 1.6 times of VSET voltage until it reaches VIN voltage. The VSET voltage must be larger than 1V to guarantee VOUT as 1.6 times of VSET voltage. An enable pin can be used to reduce power dissipation in shutdown mode. The AIC1993 provides excellent line and load regulation. The AIC1993 is available in SOP-8 package.
APPLICATIONS
Notebook PC PC Motherboard Battery Powered Systems Peripheral Cards
TYPICAL APPLICATION CIRCUIT
Typical Application Circuit
Analog Integrations Corporation
Si-Soft Research Center 3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C. TEL: 886-3-5772500 FAX: 886-3-5772510 www.analog.com.tw
DS-1993-P1 050708
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AIC1993
ORDERING INFORMATION
AIC1993XXXXX PACKING TYPE TR: TAPE & REEL TB: TUBE PACKAGING TYPE S8: SOP-8 P: Lead Free Commercial PIN CONFIGURATION
SOP-8 TOP VIEW
EN 1 VIN 2 VO 3 VSET 4
8 GND 7 GND 6 GND 5 GND
Example: AIC1993PS8TR Lead Free SOP-8 Package & Taping & Reel Packing Type
ABSOLUTE MAXIMUM RATINGS
VIN, EN, VSET to GND .......................................................................................................-0.3V to +6V Ouput Switch Current ............................................................................................................. 500mA Operating Junction Temperature ...................................................................................... 125C Operating Ambient Temperature Range.......................................... ... ............................ -40~85C Maximum Storage Temperature Range......................................................................... -65C to 150C Maximum Lead Temperature (Soldering 10s) ..............................................................................260C Thermal Resistance Junction to Case SOP8................................................................. 40C/W Thermal Resistance Junction to Ambient SOP8..............................................................160C/W (Assume no ambient airflow)
TEST CIRCUIT
Refer to Typical Application Circuit.
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AIC1993
(VIN=5V, VEN=5V, VSET=2V, CIN=COUT=2.2 TA= TJ=25C, Unless otherwise specified.) (Note1) PARAMETER
Operating Voltage Quiescent Current Shutdown Supply Current Output Voltage/VSET Voltage Line Regulation Load Regulation Output Resistance Short Circuit Current Minimum VSET Voltage VSET Pin Current VEN Voltage High VEN Voltage Low VEN Pin Bias Current Thermal-Shutdown Threshold Thermal-Shutdown Hysteresis VEN = 0 1.5 +150 1.6 0.4 10 VO = 5V VEN = 0 VIN = 5.5V, VSET = 1V to 3.2V VIN = 4.5V to 5.5V 10mA IO 500mA 1.552
ELECTRICAL CHARACTERISTICS
F,
TEST CONDITIONS
SYMBOL
VIN
MIN.
4.5
TYP.
MAX. UNITS
5.5 V mA 30 1.648 0.5 0.8 0.3 A V 200 nA V V A A V/V % %
0.5 5 1.6 0.2 0.5 0.2 0.3 1 80
IO = 500mA, VSET = 3.4V
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Note 1: Specifications are production tested at TA=25C. Specifications over the -40C to 85C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC).
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AIC1993
TYPICAL PERFORMANCE CHARACTERISTICS
VIN=VEN=5V, VSET=2V, IOUT=0.5A, CIN= 4.7 F, COUT=10 F, TA= TJ=25C
Fig.1 Load Transient Response
Fig.2 Start-UP
Fig.3 Short Circuit current
Fig.4 Overcurrent Protection Characteristics
Fig.5 Quiescent Current vs. Vin
Fig.6 Quiescent Current vs. Temperature
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AIC1993
Fig.7 Output Voltage vs. Temperature
Fig.8 Output Voltage vs. VIN
6 5 4
VIN=5.5V
VOUT(V)
3 2 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0
VSET(V)
Fig.9 Dropout Voltage vs. Iout
Fig.10 Vout vs. VSET
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AIC1993
BLOCK DIAGRAM
Functional Block Diagram of AIC1993
PIN DESCRIPTIONS
Pin 1: VEN: Enable input. Pulling this pin under 0.4V turns the regulator off, reducing the quiescent current to a fraction of its operating value. The device will be enabled if this pin is left open. Connect to VIN if not being used. VIN: Power input pin. Supply the power to the IC. VO: The pin is the power output of the regulator. Its voltage is 1.6 times of VSET.
Pin 2: Pin 3:
Pin 4: VSET: This pin sets the output voltage. Its voltage must be larger than 1V to guarantee VO as 1.6 times of VSET. Pin 5: Pin 6: Pin 7: Pin 8: GND: Reference ground. Use all four pins on the SOP-8 device. GND: Reference ground. Use all four pins on the SOP-8 device. GND: Reference ground. Use all four pins on the SOP-8 device. GND: Reference ground. Use all four pins on the SOP-8 device.
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AIC1993
APPLICATION INFORMATIONS
INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. Input ceramic capacitor at 2.2F with a 2.2uF output ceramic capacitor is recommended. EN EN is used to make system enable and disable. It supply to output voltage in shutdown logic mode of fan control. VSET The output voltage control pin has 1.6 Time become the output voltage. Voltage limilt form 0V to 3.125 V like to feedback control resistance in internal R1 and R2 modulation. POWER DISSIPATION The maximum power dissipation of AIC1993 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT (VIN-VOUT). The maximum power dissipation is: (TJ - TA) PMAX = (RJB + RBA) Where TJ-TA is the temperature difference between the die junction and the surrounding air, RJB is the thermal resistance of the package, and RBA is the thermal resistance through the PCB, copper traces, and other materials to the surrounding air. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. GND pin performs a dual function of providing an electrical connection to ground and channeling heat away. Therefore, connecting the GND pin to ground with a large pad or ground plane would increase the power dissipation and reduce the device temperature.
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AIC1993
PHYSICAL DIMENSIONS (unit: mm)
SOP-8 PACKAGE OUTLINE DRAWING
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